• DocumentCode
    106361
  • Title

    Efficient Spatial Pattern Analysis for Variation Decomposition Via Robust Sparse Regression

  • Author

    Wangyang Zhang ; Balakrishnan, K. ; Xin Li ; Boning, Duane S. ; Saxena, Shanky ; Strojwas, Andrzej ; Rutenbar, Rob

  • Author_Institution
    Carnegie Mellon Univ., Pittsburgh, PA, USA
  • Volume
    32
  • Issue
    7
  • fYear
    2013
  • fDate
    Jul-13
  • Firstpage
    1072
  • Lastpage
    1085
  • Abstract
    In this paper, we propose a new technique to achieve accurate decomposition of process variation by efficiently performing spatial pattern analysis. We demonstrate that the spatially correlated systematic variation can be accurately represented by the linear combination of a small number of templates. Based on this observation, an efficient sparse regression algorithm is developed to accurately extract the most adequate templates to represent spatially correlated variation. In addition, a robust sparse regression algorithm is proposed to automatically remove measurement outliers. We further develop a fast numerical algorithm that may reduce the computational time by several orders of magnitude over the traditional direct implementation. Our experimental results based on both synthetic and silicon data demonstrate that the proposed sparse regression technique can capture spatially correlated variation patterns with high accuracy and efficiency.
  • Keywords
    CMOS integrated circuits; integrated circuit design; regression analysis; silicon; measurement outliers; process variation decomposition; robust sparse regression; spatial pattern analysis; spatially correlated systematic variation; spatially correlated variation patterns; Dictionaries; Discrete cosine transforms; Integrated circuit modeling; Pattern analysis; Robustness; Semiconductor device modeling; Systematics; Integrated circuit; process variation; spatial variation; variation decomposition;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2013.2245942
  • Filename
    6532376