Title :
The effects of processing on radiation damage in SiO2
Author_Institution :
IBM Corporation, Hopewell Junction, NY
fDate :
4/1/1979 12:00:00 AM
Abstract :
This paper briefly reviews the general interaction of radiation with thermally grown SiO2, both phenomenologically and atomistically. Radiation-induced trapped charge, the creation of fast surface states, and the all-important neutral electron traps are discussed. The types of radiation and their concomitant damage produced by the typical processes of ion implantation, reactive ion etching, and electron-beam lithography are outlined. The effect of these processes on the oxidized silicon system is treated, and process modification to minimize radiation damage is discussed.
Keywords :
Annealing; Electron devices; Electron traps; Etching; Ion implantation; Lithography; Paramagnetic materials; Projectiles; Surface treatment; Threshold voltage;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1979.19472