• DocumentCode
    1063617
  • Title

    The effects of processing on radiation damage in SiO2

  • Author

    Gdula, R.A.

  • Author_Institution
    IBM Corporation, Hopewell Junction, NY
  • Volume
    26
  • Issue
    4
  • fYear
    1979
  • fDate
    4/1/1979 12:00:00 AM
  • Firstpage
    644
  • Lastpage
    647
  • Abstract
    This paper briefly reviews the general interaction of radiation with thermally grown SiO2, both phenomenologically and atomistically. Radiation-induced trapped charge, the creation of fast surface states, and the all-important neutral electron traps are discussed. The types of radiation and their concomitant damage produced by the typical processes of ion implantation, reactive ion etching, and electron-beam lithography are outlined. The effect of these processes on the oxidized silicon system is treated, and process modification to minimize radiation damage is discussed.
  • Keywords
    Annealing; Electron devices; Electron traps; Etching; Ion implantation; Lithography; Paramagnetic materials; Projectiles; Surface treatment; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1979.19472
  • Filename
    1480050