DocumentCode
1063617
Title
The effects of processing on radiation damage in SiO2
Author
Gdula, R.A.
Author_Institution
IBM Corporation, Hopewell Junction, NY
Volume
26
Issue
4
fYear
1979
fDate
4/1/1979 12:00:00 AM
Firstpage
644
Lastpage
647
Abstract
This paper briefly reviews the general interaction of radiation with thermally grown SiO2 , both phenomenologically and atomistically. Radiation-induced trapped charge, the creation of fast surface states, and the all-important neutral electron traps are discussed. The types of radiation and their concomitant damage produced by the typical processes of ion implantation, reactive ion etching, and electron-beam lithography are outlined. The effect of these processes on the oxidized silicon system is treated, and process modification to minimize radiation damage is discussed.
Keywords
Annealing; Electron devices; Electron traps; Etching; Ion implantation; Lithography; Paramagnetic materials; Projectiles; Surface treatment; Threshold voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1979.19472
Filename
1480050
Link To Document