DocumentCode :
1063617
Title :
The effects of processing on radiation damage in SiO2
Author :
Gdula, R.A.
Author_Institution :
IBM Corporation, Hopewell Junction, NY
Volume :
26
Issue :
4
fYear :
1979
fDate :
4/1/1979 12:00:00 AM
Firstpage :
644
Lastpage :
647
Abstract :
This paper briefly reviews the general interaction of radiation with thermally grown SiO2, both phenomenologically and atomistically. Radiation-induced trapped charge, the creation of fast surface states, and the all-important neutral electron traps are discussed. The types of radiation and their concomitant damage produced by the typical processes of ion implantation, reactive ion etching, and electron-beam lithography are outlined. The effect of these processes on the oxidized silicon system is treated, and process modification to minimize radiation damage is discussed.
Keywords :
Annealing; Electron devices; Electron traps; Etching; Ion implantation; Lithography; Paramagnetic materials; Projectiles; Surface treatment; Threshold voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1979.19472
Filename :
1480050
Link To Document :
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