Title :
Development of flip-chip bonding technology for (Cd,Zn)Te
Author :
Fiederle, Michael ; Braml, Heiko ; Fauler, Alex ; Giersch, Jürgen ; Ludwig, Jens ; Jakobs, Karl
Author_Institution :
Freiburger Materialforschungszentrum, Albert-Ludwigs-Univ. Freiburg, Germany
Abstract :
A flip-chip bonding technology has been developed for CdTe and (Cd,Zn)Te X-ray detectors. The aim of this paper is to choose a suitable chip interconnection technique for the fabrication of X-ray pixel detectors to fit the material requirements of detector grade CdTe and (Cd,Zn)Te. The proposed method is based on a flexible process, which permits the use of an eutectic PbSn alloy with a photoresist mask. A photosensitive polymer acts as a passivation layer and solder stop mask on CdTe or (Cd,Zn)Te. The proposed process provides the opportunity to do all process steps "in-house.".
Keywords :
X-ray detection; bonding processes; lead alloys; passivation; photoresists; position sensitive particle detectors; readout electronics; semiconductor counters; tin alloys; (Cd,Zn)Te X-ray detector; CdTe detector; PbSn; X-ray pixel detector; chip interconnection technique; eutectic PbSn alloy; flip-chip bonding technology; passivation layer; photoresist mask; photosensitive polymer; readout electronics; stop mask soldering; Bonding; Conductivity; Fabrication; Passivation; Polymers; Resists; Semiconductor materials; Stress; X-ray detection; X-ray detectors;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2004.832949
