• DocumentCode
    1064173
  • Title

    Laser repair of faulty packaged VLSI chips

  • Author

    Boyd, I.W. ; Nolan, A.J. ; Nayar, Vineet ; Micheli, F. ; Davidson, A. ; Swanson, G. ; George, Saly

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Univ. Coll. London
  • Volume
    24
  • Issue
    24
  • fYear
    1988
  • fDate
    11/24/1988 12:00:00 AM
  • Firstpage
    1474
  • Lastpage
    1475
  • Abstract
    Demonstrates for the first time the use of a tightly focused Ar laser beam to repair design defects in completely packaged microelectronic chips by inducing localised micro-etching chemical reactions
  • Keywords
    VLSI; laser beam machining; VLSI chips; completely packaged microelectronic chips; design defects; laser repair; localised micro-etching chemical reactions;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • Filename
    27910
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1064173