DocumentCode
1064281
Title
Plastic Encapsulated Signal and Power Transistor Reliability
Author
Herr, E.A. ; Fox, A. ; Read, J.S.
Author_Institution
Semiconductor Products Department General Electric Company
Issue
2
fYear
1974
fDate
5/1/1974 12:00:00 AM
Firstpage
117
Lastpage
148
Abstract
Since the introduction of solid encapsulated epoxy signal transistors by General Electric in 1962, substantial improvements have been made in plastic materials and packaging techniques resulting in a homogeneous solid package for semiconductor components. These advances, reflected in an excellent performance record in consumer and industrial equipments, have led to the extended use of these devices in industrial and some military applications where high reliability is demanded.
Keywords
Assembly; Defense industry; Electrical equipment industry; Packaging machines; Plastic packaging; Power transistors; Semiconductor device reliability; Silicon; Solids; Thermal stresses;
fLanguage
English
Journal_Title
Broadcast and Television Receivers, IEEE Transactions on
Publisher
ieee
ISSN
0018-9308
Type
jour
DOI
10.1109/TBTR1.1974.299822
Filename
4080199
Link To Document