• DocumentCode
    1064281
  • Title

    Plastic Encapsulated Signal and Power Transistor Reliability

  • Author

    Herr, E.A. ; Fox, A. ; Read, J.S.

  • Author_Institution
    Semiconductor Products Department General Electric Company
  • Issue
    2
  • fYear
    1974
  • fDate
    5/1/1974 12:00:00 AM
  • Firstpage
    117
  • Lastpage
    148
  • Abstract
    Since the introduction of solid encapsulated epoxy signal transistors by General Electric in 1962, substantial improvements have been made in plastic materials and packaging techniques resulting in a homogeneous solid package for semiconductor components. These advances, reflected in an excellent performance record in consumer and industrial equipments, have led to the extended use of these devices in industrial and some military applications where high reliability is demanded.
  • Keywords
    Assembly; Defense industry; Electrical equipment industry; Packaging machines; Plastic packaging; Power transistors; Semiconductor device reliability; Silicon; Solids; Thermal stresses;
  • fLanguage
    English
  • Journal_Title
    Broadcast and Television Receivers, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9308
  • Type

    jour

  • DOI
    10.1109/TBTR1.1974.299822
  • Filename
    4080199