DocumentCode
1064754
Title
The Fracture Resistance of Bonded Au Wires for Interconnection
Author
Jin-Woo Park ; Young-Bok Yoon ; Lee, Joon-Gil
Author_Institution
Dept. of Mater. Sci. & Eng., Yonsei Univ., Seoul
Volume
32
Issue
1
fYear
2009
fDate
3/1/2009 12:00:00 AM
Firstpage
106
Lastpage
109
Abstract
This paper presents the effects of the local strength degradation due to recrystallization and grain growth and the large deformation induced in wire bonding process on the fracture resistance of the bonded Au wires for interconnection. The experimental and numerical results show that, for a wire to deform to the required shape without reduction in the fracture resistance, sufficient ductility is more important than the strength of the wire.
Keywords
deformation; ductility; electronics packaging; finite element analysis; fracture; gold; interconnections; recrystallisation; Au; bonded Au wires; ductility; finite-element model; fracture resistance; interconnection; large deformation; local strength degradation; recrystallization; wire bonding process; Finite-element model (FEM); nano-indentation; recrystallization; wire bonding;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2008.2004584
Filename
4749268
Link To Document