Title :
Advances in wire bonding technology for high lead count, high-density devices
Author :
Shah, Gautam N. ; Levine, Lee R. ; Patel, Dipak I.
Author_Institution :
Kulicke & Soffa Ind. Inc., Willow Grove, PA, USA
Abstract :
How present challenges are being met by the innovation taking place in wire-bonding technology is discussed. A wire-bonder system accuracy model is discussed. Factors that affect minimum pad-size requirement and fine pitch capability are described. The requirements for attaining true-bond program portability are analyzed. Results of designed experiments undertaken to better understand the wire-bonding process are also presented.<>
Keywords :
lead bonding; fine pitch capability; high lead count; high-density devices; minimum pad-size requirement; system accuracy model; true-bond program portability; wire bonding technology; Application specific integrated circuits; Assembly; Bonding processes; Geometry; Integrated circuit packaging; Lead compounds; Manufacturing automation; Packaging machines; Semiconductor devices; Wire;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
