Title :
Thermal conductivity of filled silicone rubber and its relationship to erosion resistance in the inclined plane test
Author :
Meyer, Luiz ; Jayaram, Shesha ; Cherney, Edward A.
Author_Institution :
Waterloo Univ., Ont., Canada
Abstract :
Silicone rubber samples having various concentrations and mean particle sizes of either alumina tri-hydrate or silica filters, prepared by room temperature and heat cured under pressure (hot pressed), are tested for erosion resistance in the ASTM D2303 inclined plane tracking and erosion test. Their corresponding thermal conductivities are determined using a transient temperature technique in which an infrared laser is employed as the heat source and a thermal imaging camera as a temperature detection device. Scanning electron microscope observations show greater filler bonding to the silicone matrix in the hot pressed samples than in the room temperature vulcanized samples leading higher thermal conductivity and increased resistance to erosion, for both ATH and silica filled samples. The correlation study shows a strong relationship between the erosion resistance and the thermal conductivity of the tested samples, highlighting the importance of an outdoor insulating material to have high thermal conductivity in order to withstand dry band arcing. The results can be used to provide guidance on filler selection for silicone rubber compounding for outdoor insulation applications.
Keywords :
alumina; corrosion resistance; infrared imaging; insulation testing; scanning electron microscopes; silicone rubber; temperature measurement; thermal conductivity; alumina trihydrate; erosion resistance; erosion test; heat source; infrared laser; insulating material; scanning electron microscope; silica fillers; silicone matrix; silicone rubber; temperature detection device; thermal conductivity; thermal imaging camera; transient temperature technique; Filters; Infrared detectors; Infrared heating; Insulation; Rubber; Silicon compounds; Temperature; Testing; Thermal conductivity; Thermal resistance;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2004.1324352