Title :
Effects of a DC-Power Layer Under a Ground Plane in SFQ Circuits
Author :
Akaike, Hiroyuki ; Fujimaki, Akira ; Satoh, Tetsuro ; Hinode, Kenji ; Nagasawa, Shuichi ; Kitagawa, Yoshihiro ; Hidaka, Mutsuo
Author_Institution :
Nagoya Univ., Nagoya
fDate :
6/1/2007 12:00:00 AM
Abstract :
Large-scale SFQ integrated circuits require a large amount of dc-bias current. The magnetic fields induced by the dc-bias currents and the return currents flowing in a ground plane have a great influence on the performance of SFQ circuits. As an approach to reduce the influence, the dc-power (DCP) layer placed under a ground plane is newly introduced in SRL advanced Nb process. We have experimentally evaluated the effects of the DCP layer using SQUIDs and large-scale Josephson transmission line (JTL) circuits with more than 10,000 junctions. The SQUIDs showed that there was small magnetic flux coupling between the DCP lines and themselves and that the coupled flux was enhanced by the return current. The coupled flux decreased with increasing line width of the DCP lines and with increasing distance from the centerlines of them. In the large-scale JTL tests, the cells with DCP patterns showed wider operating margins than the CONNECT OPEN cells with partial magnetic shielding of bias current lines. The test results also showed that a line shape along the periphery of a cell was more effective than a plane shape within a cell as a DCP layer pattern for bias current feeds.
Keywords :
SQUIDs; integrated circuit testing; magnetic flux; magnetic shielding; superconducting integrated circuits; DC-power layer; Josephson transmission line circuits; SFQ integrated circuits; SQUID; dc-bias current; ground plane; magnetic flux coupling; partial magnetic shielding; return currents; single-flux-quantum; Coupling circuits; Distributed parameter circuits; Large scale integration; Large-scale systems; Magnetic circuits; Magnetic fields; Niobium; SQUIDs; Shape; Testing; Cell layout; device structure; large-scale SFQ circuits; magnetic shielding;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2007.897701