Title :
Design and fabrication of temperature-insensitive InGaP-InGaAlP resonant-cavity light-emitting diodes
Author :
Chang, Yi-An ; Yu, Chun-Lung ; Wu, I-Tsung ; Kuo, Hao-Chung ; Lu, Tien-Chang ; Lai, Fang-I ; Laih, Li-Wen ; Laih, Li-Horng ; Wang, Shing-Chung
Author_Institution :
Inst. of Electro-Opt. Eng., Nat. Chiao Tung Univ., Hsinchu
Abstract :
Visible InGaP-InGaAlP resonant-cavity light-emitting diodes with low-temperature sensitivity output characteristics were demonstrated. By means of widening the resonant cavity to a thickness of three wavelength (3lambda), the degree of power variation between 25 degC and 95 degC for the devices biased at 20 mA was apparently reduced from -2.1 dB for the standard structure design (1-lambda cavity) to -0.6 dB. An output power of 2.4 mW was achieved at 70 mA. The external quantum efficiency achieved a maximum of 3% at 13 mA and dropped slowly with increased current for the device. The external quantum efficiency at 20mA dropped only 14% with elevated temperature from 25 degC to 95degC. The current dependent far-field patterns also showed that the emission always took place perfectly in the normal direction, which was suitable for plastic fiber data transmission
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; indium compounds; integrated optoelectronics; light emitting diodes; optical resonators; 13 mA; 2.4 mW; 20 mA; 25 to 95 degC; 70 mA; InGaP-InGaAlP; InGaP-InGaAlP light-emitting diodes; current dependent far-field patterns; external quantum efficiency; light-emitting diodes; low temperature sensitivity; plastic fiber data transmission; resonant-cavity light-emitting diodes; standard structure design; temperature-insensitive light-emitting diodes; Bandwidth; Data communication; Fabrication; Light emitting diodes; Optical fiber communication; Optical modulation; Plastics; Power generation; Resonance; Temperature dependence; InGaAlP; light-emitting diode (LED); optical communication; optoelectronic device; resonant cavity;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2006.879931