DocumentCode :
10657
Title :
A Reliability Enhanced Address Mapping Strategy for Three-Dimensional (3-D) NAND Flash Memory
Author :
Yi Wang ; Zili Shao ; Chan, Henry ; Bathen, L.A.D. ; Dutt, N.D.
Author_Institution :
Dept. of Comput., Hong Kong Polytech. Univ., Hong Kong, China
Volume :
22
Issue :
11
fYear :
2014
fDate :
Nov. 2014
Firstpage :
2402
Lastpage :
2410
Abstract :
The linear scaling down of NAND flash memory is approaching its physical, electrical, and reliability limitations. To maintain the current trend of increasing bit density and reducing bit per cost, 3-D flash memory is emerging as a viable solution to fulfill the ever-increasing demands of storage capacity. In 3-D NAND flash memory, multiple layers are stacked to provide ultrahigh density storage devices. However, the physical architecture of 3-D flash memory leads to a higher probability of disturbance to adjacent physical pages and greatly increases bit error rates. This paper presents a novel physical-location-aware address mapping strategy for 3-D NAND flash memory. It permutes the physical mapping of pages and maximizes the distance between the consecutively logical pages, which can significantly reduce the disturbance to adjacent physical pages and effectively enhance the reliability. The proposed mapping strategy is applied to a representative flash storage system. Experimental results show that the proposed scheme can reduce uncorrectable page errors by 70.16% with less than 10.01% space overhead in comparison with the baseline scheme.
Keywords :
NAND circuits; flash memories; integrated circuit reliability; integrated memory circuits; three-dimensional integrated circuits; 3D integrated circuits; physical-location aware address mapping strategy; reliability enhanced address mapping strategy; three-dimensional NAND flash memory; Ash; Drives; Educational institutions; Logic gates; Physical layer; Reliability; Resource management; 3-D integrated circuits; data storage systems; error correction codes; fault tolerance; flash memories; reliability;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2013.2288687
Filename :
6678650
Link To Document :
بازگشت