• DocumentCode
    1065960
  • Title

    Fabrication of a Short-Period Nb3Sn Superconducting Undulator

  • Author

    Dietderich, Daniel R. ; Godeke, Arno ; Prestemon, Soren O. ; Pipersky, Paul T. ; Liggins, Nate L. ; Higley, Hugh C. ; Marks, Steve ; Schlueter, Ross D.

  • Author_Institution
    LBNL, Berkeley
  • Volume
    17
  • Issue
    2
  • fYear
    2007
  • fDate
    6/1/2007 12:00:00 AM
  • Firstpage
    1243
  • Lastpage
    1246
  • Abstract
    Lawrence Berkeley National Laboratory develops high-field Nb3Sn magnets for HEP applications. In the past few years, this experience has been extended to the design and fabrication of undulator magnets. Some undulator applications require devices that can operate in the presence of a heat load from a beam. The use of Nb3Sn permits operation of a device at both a marginally higher temperature (5-8 K) and a higher Jc, compared to NbTi devices, without requiring a larger magnetic gap. A half-undulator device consisting of 6 periods (12 coil packs) of 14.5 mm period was designed, wound, reacted, potted and tested. It reached the short sample current limit of 717 A in 4 quenches. The non-Cu Jc of the strand was over 7,600 A /mm2 and the Cu current density at quench was over 8,000 A/mm2 . Magnetic field models show that if a complete device was fabricated with the same parameters one could obtain beam fields of 1.1 T and 1.6 T for pole gaps of 8 mm and 6 mm, respectively.
  • Keywords
    critical current density (superconductivity); niobium alloys; superconducting coils; superconducting magnets; superconducting materials; tin alloys; wigglers; current density; heat load; high-field magnets; magnetic field models; pole gaps; short-period superconducting undulator fabrication; Coils; Fabrication; Laboratories; Magnetic devices; Magnets; Niobium compounds; Temperature; Tin; Titanium compounds; Undulators; ${rm Nb}_{3}{rm Sn}$; superconducting undulator;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2007.897747
  • Filename
    4277360