DocumentCode :
1065960
Title :
Fabrication of a Short-Period Nb3Sn Superconducting Undulator
Author :
Dietderich, Daniel R. ; Godeke, Arno ; Prestemon, Soren O. ; Pipersky, Paul T. ; Liggins, Nate L. ; Higley, Hugh C. ; Marks, Steve ; Schlueter, Ross D.
Author_Institution :
LBNL, Berkeley
Volume :
17
Issue :
2
fYear :
2007
fDate :
6/1/2007 12:00:00 AM
Firstpage :
1243
Lastpage :
1246
Abstract :
Lawrence Berkeley National Laboratory develops high-field Nb3Sn magnets for HEP applications. In the past few years, this experience has been extended to the design and fabrication of undulator magnets. Some undulator applications require devices that can operate in the presence of a heat load from a beam. The use of Nb3Sn permits operation of a device at both a marginally higher temperature (5-8 K) and a higher Jc, compared to NbTi devices, without requiring a larger magnetic gap. A half-undulator device consisting of 6 periods (12 coil packs) of 14.5 mm period was designed, wound, reacted, potted and tested. It reached the short sample current limit of 717 A in 4 quenches. The non-Cu Jc of the strand was over 7,600 A /mm2 and the Cu current density at quench was over 8,000 A/mm2 . Magnetic field models show that if a complete device was fabricated with the same parameters one could obtain beam fields of 1.1 T and 1.6 T for pole gaps of 8 mm and 6 mm, respectively.
Keywords :
critical current density (superconductivity); niobium alloys; superconducting coils; superconducting magnets; superconducting materials; tin alloys; wigglers; current density; heat load; high-field magnets; magnetic field models; pole gaps; short-period superconducting undulator fabrication; Coils; Fabrication; Laboratories; Magnetic devices; Magnets; Niobium compounds; Temperature; Tin; Titanium compounds; Undulators; ${rm Nb}_{3}{rm Sn}$; superconducting undulator;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2007.897747
Filename :
4277360
Link To Document :
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