DocumentCode
1066427
Title
Engineering software-multichip routing and placement
Author
Dai, Wayne Wei-Ming
Author_Institution
Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
Volume
29
Issue
11
fYear
1992
fDate
11/1/1992 12:00:00 AM
Firstpage
61
Abstract
The demands being placed on CAD systems by current advances in packaging technology, in particular, the need to design interconnecting networks for thin-film multichip modules (MCMs), are discussed. The approaches embodied in several recently developed software packages are described. These include interactive placement and routing, warping, shape-based routing, rubber-band routing, and correct by design. The role of concurrent engineering in the design process is examined
Keywords
circuit layout CAD; concurrent engineering; multichip modules; network routing; software packages; CAD systems; MCM; concurrent engineering; correct by design; interactive placement; interactive routing; interconnecting network design; packaging; rubber-band routing; shape-based routing; software packages; thin-film multichip modules; warping; Aging; Costs; Design automation; Design engineering; Manufacturing; Multichip modules; Routing; Substrates; Sun; Transistors;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/6.166502
Filename
166502
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