Title :
Engineering software-multichip routing and placement
Author :
Dai, Wayne Wei-Ming
Author_Institution :
Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
fDate :
11/1/1992 12:00:00 AM
Abstract :
The demands being placed on CAD systems by current advances in packaging technology, in particular, the need to design interconnecting networks for thin-film multichip modules (MCMs), are discussed. The approaches embodied in several recently developed software packages are described. These include interactive placement and routing, warping, shape-based routing, rubber-band routing, and correct by design. The role of concurrent engineering in the design process is examined
Keywords :
circuit layout CAD; concurrent engineering; multichip modules; network routing; software packages; CAD systems; MCM; concurrent engineering; correct by design; interactive placement; interactive routing; interconnecting network design; packaging; rubber-band routing; shape-based routing; software packages; thin-film multichip modules; warping; Aging; Costs; Design automation; Design engineering; Manufacturing; Multichip modules; Routing; Substrates; Sun; Transistors;
Journal_Title :
Spectrum, IEEE
