DocumentCode :
1066630
Title :
Fabrication Process for RSFQ/Qubit Systems
Author :
Grönberg, Leif ; Hassel, Juha ; Helistö, Panu ; Ylilammi, M.
Author_Institution :
VTT, Espoo
Volume :
17
Issue :
2
fYear :
2007
fDate :
6/1/2007 12:00:00 AM
Firstpage :
952
Lastpage :
954
Abstract :
We have developed a Nb/Al/AlOx/Nb trilayer process aimed towards integration of RSFQ and qubit circuits. The emphasis is to provide a process enabling RSFQ operation at sub-100 mK temperatures required for qubit operation. In this paper we describe the main properties of the process. We also present experimental characterization data and in particular introduce a method of determining the critical current density by wafer level room temperature measurements.
Keywords :
aluminium; aluminium compounds; critical current density (superconductivity); niobium; superconducting junction devices; Nb-Al-AlOx-Nb; RSFQ/qubit circuit; critical current density; trilayer fabrication process; wafer level room temperature measurement; Circuits; Cooling; Critical current density; Fabrication; Josephson junctions; Niobium; Plasma temperature; Resistors; Sputter etching; Wet etching; Fabrication; RSFQ; niobium; qubit;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2007.897721
Filename :
4277419
Link To Document :
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