Title :
Radiation Curable Conductive Ink
Author :
Bolon, D.A. ; Lucas, G.M. ; Schroeter, S.H.
Author_Institution :
General Electric Company Corporate Research and Development Center P.O. Box 8 Schenectady, New York 12301
fDate :
4/1/1978 12:00:00 AM
Abstract :
A radiation curable, screen printable conductive ink has been developed for use on thermoplastic circuit boards. The fast application and cure of this solventless material allow mass production of low cost circuits suitable for use with systems that can tolerate higher resistance. In one application, a photoflash array, Flipflash, utilizes a piezoelectric crystal to provide the high voltage necessary to overcome the resistance of the system. The conductive medium in this ink was identified from a wide range of available materials. It allows a rapid radiation cure of the binder which provides excellent adhesion and circuit stability.
Keywords :
Conducting materials; Costs; Crystalline materials; Ink; Mass production; Plastics; Printed circuits; Printing; Resins; Voltage;
Journal_Title :
Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TEI.1978.298060