DocumentCode
1067375
Title
Abstracts of forthcoming manuscripts
Volume
25
Issue
3
fYear
2002
fDate
7/1/2002 12:00:00 AM
Firstpage
151
Lastpage
153
Abstract
Provides an abstract of articles to be presented in a forthcoming issue.
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2002.807532
Filename
1158823
Link To Document