DocumentCode
1067385
Title
Foreword
Volume
25
Issue
3
fYear
2002
fDate
7/1/2002 12:00:00 AM
Firstpage
154
Lastpage
154
Keywords
Bonding; Consumer electronics; Electronic packaging thermal management; Electronics packaging; Environmentally friendly manufacturing techniques; Integrated optics; Lead; Microwave devices; Microwave theory and techniques; Sections;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2002.802776
Filename
1158824
Link To Document