مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

1067385

Title :

Foreword

Volume :

Issue :

fYear :

2002

fDate :

7/1/2002 12:00:00 AM

Firstpage :

154

Lastpage :

154

Keywords :

Bonding; Consumer electronics; Electronic packaging thermal management; Electronics packaging; Environmentally friendly manufacturing techniques; Integrated optics; Lead; Microwave devices; Microwave theory and techniques; Sections;

fLanguage :

English

Journal_Title :

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher :

ieee

ISSN :

1521-334X

Type :

jour

DOI :

10.1109/TEPM.2002.802776

Filename :

1158824

Link To Document :

https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1067385