Title :
Comprehensive treatment of moisture induced failure-recent advances
Author :
Wong, E.H. ; Koh, S.W. ; Lee, K.H. ; Rajoo, R.
Author_Institution :
Inst. of Microelectron., Singapore, Singapore
fDate :
7/1/2002 12:00:00 AM
Abstract :
This paper describes a comprehensive treatment of moisture induced failure in integrated circuit (IC) packaging with emphasis on recent advances. This includes advanced technique for modeling moisture diffusion under dynamic boundary conditions such as experienced by packages during solder reflow, autoclave, and temperature-humidity cycling; advanced characterization technique for moisture sorption and diffusion properties of packaging materials including effect of edge diffusion on transverse diffusivity, anisotropic diffusivity in organic laminates, impact of non-Fickian sorption; advanced techniques for modeling vapor pressure during solder reflow; advanced techniques for modeling dynamic delamination propagation during solder reflow; interfacial fracture strength as a function of temperature and moisture; as well as plastic analysis of popcorn cracking.
Keywords :
adhesion; cracks; delamination; diffusion; failure analysis; fracture toughness; integrated circuit packaging; integrated circuit reliability; modelling; moisture; reflow soldering; sorption; vapour pressure; IC packaging; anisotropic diffusivity; characterization technique; dynamic boundary conditions; dynamic delamination propagation; edge diffusion; finite element modeling; hygroscopic swelling; interfacial adhesion characterisation; interfacial fracture strength; moisture diffusion modeling; moisture induced failure; moisture sorption; nonFickian sorption; organic laminates; packaging materials; plastic analysis; plastic collapse; popcorn cracking; solder reflow; transverse diffusivity; vapor pressure; Anisotropic magnetoresistance; Boundary conditions; Delamination; Integrated circuit packaging; Laminates; Moisture; Organic materials; Plastic integrated circuit packaging; Plastic packaging; Semiconductor device modeling;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2002.804613
