DocumentCode :
1067731
Title :
Simulation of spatial fault distributions for integrated circuit yield estimations
Author :
Stapper, Charles H.
Author_Institution :
IBM, Essex Junction, VT, USA
Volume :
8
Issue :
12
fYear :
1989
fDate :
12/1/1989 12:00:00 AM
Firstpage :
1314
Lastpage :
1318
Abstract :
Two methods used in fault simulation for integrated circuit modeling are described. Both methods simulate clustered fault locations on a map. In the first approach, the clusters are initially generated using a radial Gaussian probability distribution. The results are consequently passed through cluster shaping programs, which produce clusters that resemble those observed on actual integrated circuit wafers. In the second approach, faults are added to the chips as a function of time. The probability that additional faults are created during any interval of time is assumed to be related to the number of faults already on the chip, as well as the number of faults on adjacent chips. This technique generates frequency distributions of the number of faults per chip that closely resemble those observed in actual integrated circuits
Keywords :
digital simulation; fault location; integrated circuit technology; probability; statistical analysis; IC modelling; cluster shaping programs; clustered fault locations; fault simulation; faults per chip; frequency distributions; integrated circuit yield estimations; program implementation; radial Gaussian probability distribution; random cluster generator; spatial fault distributions; Circuit faults; Circuit simulation; Fault location; Fault tolerance; Frequency; Integrated circuit modeling; Integrated circuit yield; Probability distribution; Semiconductor device modeling; Yield estimation;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.44511
Filename :
44511
Link To Document :
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