Impurity gettering of polycrystalline solar cells fabricated from refined metallurgical-grade silicon

A damage-gettering technique is described which reduces the impurity content in grown crystals and enhances cell performance of diffused solar cells. Crystalline ingots were Czochralski-grown from an acid-leached metallurgical-grade source. Damage gettering was performed by preparing a mechanically damaged layer on the wafer back surface and subsequent annealing. Optimum annealing conditions were investigated as a function of ambient gas species, temperature, and time. In an O2ambient, the fill factor of the cells degraded to 0.25, while cell performance was greatly improved by annealing in N2. Conversion efficiency tends to increase with annealing time at higher temperatures. Maximum conversion efficiencies attained for mono- and polycrystalline solar cells fabricated from MG-Si are 9.8 and 7.7 percent, respectively. Light current-voltage characteristics and the leakage-current variations with depth were analyzed. It was found that impurity gettering begins at the wafer surfaces and proceeds gradually into the bulk regions.