DocumentCode :
106827
Title :
An External Circuit Model for 3-D Electromagnetic Particle-In-Cell Simulations
Author :
Ming-Chieh Lin ; Chuandong Zhou ; Smithe, David N.
Author_Institution :
Tech-X Corp., Boulder, CO, USA
Volume :
61
Issue :
6
fYear :
2014
fDate :
Jun-14
Firstpage :
1742
Lastpage :
1748
Abstract :
In this paper, for the first time, second-order accurate algorithms for coupling external circuit elements to 3-D electromagnetic (EM) particle-in-cell (PIC) simulations are developed and introduced. The circuit equation including an external voltage or current source, resistance, inductance, capacitance, and a dynamic EM and/or plasma load is solved simultaneously and self-consistently with the EM PIC updaters through an instant measured voltage V across the system to obtain the supplied current I for feeding into the system. This external circuit model has been demonstrated and implemented in a 3-D conformal finite-difference time-domain PIC code, Vorpal. The integrated simulation model can be widely used in the vacuum electronics community as well as in the plasma processing community if one wants to consider the effects of a power supply on operation of microwave tubes or plasma reaction chambers.
Keywords :
finite difference time-domain analysis; integrated circuit modelling; microwave tubes; power supply circuits; vacuum microelectronics; 3D conformal finite-difference time-domain PIC code; 3D electromagnetic particle-in-cell simulations; circuit equation; coupling external circuit elements; current source; external circuit model; external voltage; instant measured voltage; integrated simulation; microwave tubes; plasma load; plasma processing community; plasma reaction chambers; power supply; second-order accurate algorithms; supplied current; vacuum electronics; Electrodes; Equations; Integrated circuit modeling; Mathematical model; Plasmas; RLC circuits; Solid modeling; Conformal finite-difference time-domain (CFDTD); electromagnetic (EM); external circuit; particle-in-cell (PIC); particle-in-cell (PIC).;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2014.2304715
Filename :
6744605
Link To Document :
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