DocumentCode :
1068323
Title :
Modeling dynamic clustering of arsenic including non-negligible concentrations of arsenic-point defect pairs
Author :
Bauer, Harald ; Pichler, Peter ; Ryssel, Heiner
Author_Institution :
Fraunhofer Inst. fur Integrierte Schaltungen, Erlangen, Germany
Volume :
8
Issue :
4
fYear :
1995
fDate :
11/1/1995 12:00:00 AM
Firstpage :
414
Lastpage :
418
Abstract :
The time dependent deactivation of RTA-activated arsenic-doped samples was studied for chemical concentrations from 2·1020 cm-3 to 1·1021 cm-3 in the temperature range from 700°C to 900°C using a newly developed experimental set-up. It is based on the use of homogeneously doped SOI material which helped to avoid experimental problems, allowed a repeated usage of the same samples, and simplified the interpretation of the electrical measurements. The dependence of the active concentrations after long-time anneals on the total concentration indicated that the deactivation behavior can be described by a simple cluster law. But even at low concentrations it was reported in the literature that the electron concentration is significantly below the total arsenic concentration. This was attributed to pair formation between arsenic atoms and intrinsic point defects. Intended as an engineering model, the model proposed here combines both approaches and gives a consistent dynamical description of the electrically active arsenic concentration from low to high concentrations
Keywords :
arsenic; doping profiles; electron density; elemental semiconductors; impurity-defect interactions; point defects; rapid thermal annealing; semiconductor doping; semiconductor process modelling; silicon; silicon-on-insulator; 700 to 900 C; RTA; SOI material; Si:As; annealing; arsenic concentration; arsenic-point defect pairs; deactivation; dopant activation; dynamic clustering; electrical measurements; electron concentration; engineering model; Annealing; Chemical vapor deposition; Circuits; Contacts; Electric variables measurement; Electrons; Helium; Semiconductor devices; Silicon on insulator technology; Temperature distribution;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.475183
Filename :
475183
Link To Document :
بازگشت