DocumentCode :
1068616
Title :
Trapped field analysis in an HTS bulk with a crack using 3D finite element method
Author :
Hahn, Seung-yong ; Kim, Sung-Hoon ; Hahn, Song-Yop
Author_Institution :
Francis Bitter Magnet Lab., Massachusetts Inst. of Technol., Cambridge, MA, USA
Volume :
14
Issue :
2
fYear :
2004
fDate :
6/1/2004 12:00:00 AM
Firstpage :
634
Lastpage :
637
Abstract :
The trapped field variation of a high temperature superconducting (HTS) bulk before and after a crack happens, which was impossible to simulate using 2D analysis method, was calculated in this paper. 3D finite element method (FEM) and iteration method were used to find screening current distribution inside an HTS bulk. In 3D analysis of an HTS bulk with a crack, calculated current distribution inside an HTS bulk should obey the equation of current continuity. For this purpose, ∇φ variable was set to satisfy the equation of current continuity, which was impossible to be considered directly by the FEM governing equation using critical state model. Also, boundary condition at the surface of an HTS bulk was applied to consider the equation of current continuity. Simulation results were compared with experimental ones to verify the validity of the suggested simulation method.
Keywords :
cracks; critical current density (superconductivity); current distribution; finite element analysis; high-temperature superconductors; iterative methods; magnetic field effects; superconducting magnets; 3D finite element method; HTS bulk crack; critical state model; current continuity; high temperature superconducting bulk; iteration method; screening current distribution; trapped field analysis; trapped field variation; Bean model; Current density; Current distribution; Energy storage; Finite element methods; High temperature superconductors; Magnetic analysis; Maxwell equations; Superconducting magnets; Temperature distribution; Crack; D finite element method; HTS bulk; iteration method; trapped field analysis;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2004.830008
Filename :
1324873
Link To Document :
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