DocumentCode :
1068723
Title :
A silicon-on-silicon field programmable multichip module (FPMCM) integrating FPGA and MCM technologies
Author :
Darnauer, Joel ; Isshiki, Tsuyoshi ; Garay, Porfirio ; Ramirez, John ; Maheshwari, Vijayshri ; Dai, Wayne Wei-Ming
Author_Institution :
Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
Volume :
18
Issue :
4
fYear :
1995
fDate :
11/1/1995 12:00:00 AM
Firstpage :
601
Lastpage :
608
Abstract :
Multichip module technology can dramatically increase the capability of field programmable logic devices (FPLD´s) and field programmable systems (FPS). We present the special advantages that MCM´s offer FPLD´s and the design of our first-generation field programmable multichip module (FPMCM). Our prototype is the first silicon-on-silicon FPMCM and has a maximum capacity of 40 K gates and 256 user IO, achieving a factor of four increase in capacity over the FPLD family with which it was designed. Our FPMCM has bean demonstrated in a system that can deliver 200 MOP´s of computing power for image processing applications. FPMCM´s can cost-effectively deliver 4-8 times the capacity of the largest FPLD´s and provide even larger reductions in the area of PCB-based field programmable systems. The upper capacity limits for FPMCM are determined mainly by the cost and defect density of the substrate technology. As CMOS processes move into the deep-submicron range, FPMCM´s will even faster and denser substrates
Keywords :
field programmable gate arrays; multichip modules; FPGA; MCM; Si; area; capacity; computing power; field programmable logic device; field programmable multichip module; field programmable system; image processing; silicon-on-silicon FPMCM; Added delay; CMOS technology; Costs; Field programmable gate arrays; Logic circuits; Logic design; Manufacturing processes; Multichip modules; Packaging; Programmable logic arrays;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.475264
Filename :
475264
Link To Document :
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