DocumentCode :
1068951
Title :
Fault isolation and performance characterization of high speed digital multichip modules
Author :
Keezer, David C.
Author_Institution :
South Florida Univ., Tampa, FL, USA
Volume :
18
Issue :
4
fYear :
1995
fDate :
11/1/1995 12:00:00 AM
Firstpage :
614
Lastpage :
619
Abstract :
This paper describes two methods for testing high performance digital multichip modules (MCM´s). The first technique provides a method for multiplexing automatic test system channels so that clock and data rates can be extended beyond the normal frequency limits of the automatic test equipment (ATE). The multiplexing method has been successfully applied at rates up to 1.6 GHz using 200 MHz ATE. The second approach utilizes an electron beam probe system operating in the voltage contrast mode to measure electrical signals within the MCM. The e-beam probe can be used to supplement scan-based techniques for isolating faults. It can also be used for characterizing signal quality (risetime, overshoot, crosstalk, reflections) and measurement of relative delays in high performance MCM´s
Keywords :
automatic testing; electron beam applications; electron beam testing; fault diagnosis; fault location; integrated circuit testing; multichip modules; multiplexing; 1.6 GHz; 200 MHz; automatic testing; crosstalk; delays; electrical signals; electron beam probe; fault isolation; high speed digital multichip modules; multiplexing; overshoot; reflections; risetime; voltage contrast; Automatic test equipment; Automatic testing; Clocks; Electron beams; Frequency; Multichip modules; Multiplexing equipment; Probes; System testing; Voltage;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.475266
Filename :
475266
Link To Document :
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