Modeling and analysis of multichip module power supply planes

Author

Lee, Keunmyung ; Barber, Alan

Author_Institution

Hewlett-Packard Co., Palo Alto, CA, USA

Volume

18

Issue

4

fYear

1995

fDate

11/1/1995 12:00:00 AM

Firstpage

628

Lastpage

639

Abstract

A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed. It is compatible with a SPICE-based modeling method for the rest of the power supply hierarchy and the devices. A modified SPICE is used to accommodate distributed circuits. The distributed circuits are built with microwave analysis software and connected to SPICE by s-parameter files. The modeling process is described and examples of thick and thin-film power supply planes are presented with comparison to measured results. The method is used to explore potential design choices for a large MCM with many simultaneously switching drivers

Keywords

S-parameters; SPICE; distributed parameter networks; integrated circuit modelling; multichip modules; power supply circuits; S-parameters; SPICE; bypass capacitors; design; distributed circuits; microwave analysis software; modeling; multichip module power supply planes; simultaneously switching drivers; thick film modules; thin film modules; Capacitors; Microwave circuits; Microwave devices; Multichip modules; Power measurement; Power supplies; SPICE; Scattering parameters; Thickness measurement; Thin film circuits;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.475268

Filename

475268