Title :
Modeling and analysis of multichip module power supply planes
Author :
Lee, Keunmyung ; Barber, Alan
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
fDate :
11/1/1995 12:00:00 AM
Abstract :
A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed. It is compatible with a SPICE-based modeling method for the rest of the power supply hierarchy and the devices. A modified SPICE is used to accommodate distributed circuits. The distributed circuits are built with microwave analysis software and connected to SPICE by s-parameter files. The modeling process is described and examples of thick and thin-film power supply planes are presented with comparison to measured results. The method is used to explore potential design choices for a large MCM with many simultaneously switching drivers
Keywords :
S-parameters; SPICE; distributed parameter networks; integrated circuit modelling; multichip modules; power supply circuits; S-parameters; SPICE; bypass capacitors; design; distributed circuits; microwave analysis software; modeling; multichip module power supply planes; simultaneously switching drivers; thick film modules; thin film modules; Capacitors; Microwave circuits; Microwave devices; Multichip modules; Power measurement; Power supplies; SPICE; Scattering parameters; Thickness measurement; Thin film circuits;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
