A clustered yield model for SMT boards and MCM´s

Author

Tegethoff, Mick M V ; Chen, Tom W.

Author_Institution

Manuf. Test Div., Hewlett-Packard Co., Loveland, CO, USA

Volume

18

Issue

4

fYear

1995

fDate

11/1/1995 12:00:00 AM

Firstpage

640

Lastpage

643

Abstract

This paper describes a clustered yield model for complex surface mount technology (SMT) assemblies and multichip modules (MCM´s). Based on yield modeling techniques that have been proven in the manufacturing of integrated circuits (IC´s), this model uses the negative binomial distribution of defects to calculate board yield after test. Manufacturing data validates that this: model accurately predicts the clustering of defects and the yield predictions are significantly better than traditional binomial models

Keywords

binomial distribution; integrated circuit modelling; integrated circuit yield; multichip modules; surface mount technology; MCMs; SMT boards; clustered yield model; defects; integrated circuits; manufacturing; multichip modules; negative binomial distribution; surface mount technology; Assembly; Circuit testing; Integrated circuit manufacture; Integrated circuit modeling; Integrated circuit testing; Integrated circuit yield; Multichip modules; Predictive models; Surface-mount technology; Virtual manufacturing;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.475269

Filename

475269