Title :
Design and cooling characteristic results of cryogenic system for 6.6 kV/200 A inductive fault current limiter
Author :
Kang, Hyoungku ; Ahn, Min Cheol ; Kim, Hyung Jin ; Chang, Ho-Myung ; Ko, Tae Kuk
Author_Institution :
Dept. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
fDate :
6/1/2004 12:00:00 AM
Abstract :
The conduction-cooled cryogenic cooling system for 1.2 kV/80 A inductive superconducting fault current limiter (SFCL) was fabricated and tested for its cooling characteristics in 2002. The observed thermal stability of the conduction-cooled system was very unreliable and precarious for the applied superconducting equipment with very large variation of currents like SFCL. Therefore, we replaced the conduction-cooled system with the sub-cooled nitrogen system for the 6.6 kV/200 A SFCL. In this paper, the design techniques and test results of cooling characteristics were introduced. The conditions for achieving the sub-cooled nitrogen state were 1 atm and 64 K. First, the temperature of 64 K was achieved by using the rotary pump and then the pressure of 1 atm was achieved by GHe. The characteristics of liquid nitrogen were strongly enhanced in these conditions. This fabricated cryogenic system merely for the short run operation test SFCL. Finally, the cryogenic system for the long run operation test SFCL was introduced.
Keywords :
fault current limiters; magnetic cooling; reactors (electric); superconducting devices; thermal stability; 1 atm; 1.2 kV; 200 A; 6.6 kV; 64 K; 80 A; applied superconducting equipment; conduction-cooled system; cryogenic cooling system; helium gas; inductive fault current limiter; liquid nitrogen; rotary pump; subcooled nitrogen system; superconducting fault current limiter; thermal stability; Cooling; Copper; Cryogenics; Fault current limiters; High temperature superconductors; Inductors; Nitrogen; Superconducting films; Superconducting transmission lines; System testing; Cooling system; SFCL; inductive SFCL; sub-cooled nitrogen;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2004.830309