• DocumentCode
    1069722
  • Title

    Microstructure and Jc-B performance of DRHQ processed Nb3Al tape with Ag stabilizer

  • Author

    Kikuchi, A. ; Iijima, Y. ; Banno, N. ; Takeuchi, T. ; Inoue, K. ; Nimori, S. ; Kosuge, M. ; Yuyama, M.

  • Author_Institution
    Nat. Inst. for Mater. Sci., Ibaraki, Japan
  • Volume
    14
  • Issue
    2
  • fYear
    2004
  • fDate
    6/1/2004 12:00:00 AM
  • Firstpage
    1008
  • Lastpage
    1011
  • Abstract
    The DRHQ process was applied to the jelly-rolled Nb3Al precursors having internal Ag stabilizers. The Ag internal stabilizer is effective to improve the superconducting stability of the DRHQ processed conductor with the Ag-stabilizer/non-Ag ratio of 0.32. The DRHQ process needs a reduction of a bending strain of the precursors, such as tape-formed specimen. The maximum Tc and Bc2(4.2 K) of the DRHQ-processed tape with Ag stabilizer are 18.4 K and 29.7 T, respectively. Large transport core-Jc(4.2 K) of 210 A/mm2 was obtained at high magnetic field of 25 T, which is 20 times larger than that of the typical RHQT-processed wires. On the other hand, Jc in fields below 20 T apparently decreased with increasing the peak heating temperature during the second-RHQ. According to the TEM observation, the stacking faults were still formed in the DRHQ-processed Nb3Al, but their density becomes very small compared with that of the RHQT-processed Nb3Al. In addition, the stacking faults gradually vanished with increasing the peak heating temperature. The grain size of several hundred nanometers for the DRHQNb3Al is still rather small. Thus, these results support that the stacking faults should be dominant as the effective pinning center for the both of RHQT- and DRHQ-processed Nb3Al conductors.
  • Keywords
    aluminium alloys; critical current density (superconductivity); grain size; niobium alloys; quenching (thermal); rapid thermal processing; silver; stacking faults; superconducting critical field; superconducting tapes; superconducting transition temperature; transmission electron microscopy; type II superconductors; 18.4 K; 25 T; 29.7 T; 4.2 K; Ag; Ag stabilizer; Bc2; DRHQ-processed conductor; DRHQ-processed tape; Jc-B performance; Nb3Al; Nb3Al conductor; RHQT-processed wires; TEM microstructure; bending strain; grain size; heating temperature; internally stabilized precursor; jelly-rolled precursors; magnetic field; pinning center; stacking faults; superconducting stability; Capacitive sensors; Conductors; Heating; Magnetic cores; Microstructure; Niobium; Stability; Stacking; Superconducting films; Temperature; $ Al conductor; $B_c2$; $J_c$; $T_c$; Ag internal-stabilized precursor; DRHQ process; Nb$_; TEM microstructure; pinning center; stacking fault;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2004.830368
  • Filename
    1324964