DocumentCode
1069928
Title
Improved Reliability Performances of SONOS-Type Devices Using Hot-Hole Erase Method by Novel Negative FN Operations
Author
Hsiao, Yi-Hsuan ; Lue, Hang-Ting ; Shih, Yen-Hao ; Lai, Erh-Kun ; Hsieh, Kuang-Yeu ; Liu, Rich ; Lu, Chih-Yuan
Author_Institution
Emerging Central Lab., Macronix Int. Co., Ltd., Hsinchu
Volume
8
Issue
2
fYear
2008
fDate
6/1/2008 12:00:00 AM
Firstpage
344
Lastpage
351
Abstract
Several novel negative Fowler-Nordheim (FN) operations for hot-hole-erased SONOS-type devices are studied. By using p+-poly gate instead of n+-poly gate, gate injection is greatly suppressed, and the device shows self-convergent VT after -FN. By using this self-converging property, -FN operation can be applied to both erased and programmed states in various sequences/algorithms. In the erase state, a short -FN channel erase called "soft erase" can be performed after hot-hole sector erase. It provides a strong electrical annealing effect to recover the hot-hole damages. On the other hand, "refill" is a shorter version of the soft erase method that expels shallow-level electrons and replaces them with deeper level ones. A spectrum blue shift model is proposed to explain the shifting of the trapped-electron energy distribution to a bluer (deeper) spectrum during refill. Various soft erase and refill conditions are examined to study the charge loss mechanism. The experimental results exhibit superior retention by combining the suitable soft erase and refill conditions. We find that the vertical charge losses measured by VG -accelerated retention test at room temperature (25 degC) are highly correlated to that measured at high temperature baking (150 degC), and a reliability model is proposed to explain these mechanisms.
Keywords
annealing; flash memories; random-access storage; semiconductor device reliability; semiconductor-insulator-semiconductor devices; spectral line shift; charge loss mechanism; deeper level electrons; electrical annealing effect; flash memories; gate injection; hot-hole erase method; hot-hole-erased SONOS-type devices; negative Fowler-Nordheim operations; reliability model; shallow-level electrons; soft erase method; spectrum blue shift model; temperature 150 degC; temperature 293 K to 298 K; trapped-electron energy distribution; vertical charge losses; Annealing; NROM; SONOS; annealing; hot-hole erase; negative FN,; negative Fowler–Nordheim (FN); refill; reliability; soft erase; vertical charge loss;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2008.917510
Filename
4451351
Link To Document