• DocumentCode
    1070196
  • Title

    Three-dimensional-simulation of arc motion between arc runners including the influence of ferromagnetic material

  • Author

    Lindmayer, Manfred ; Springstubbe, Matthias

  • Author_Institution
    Inst. fur Hochspannungstechnik und Elektrische Energieanlagen, Tech. Univ. Brauschweig, Braunschweig, Germany
  • Volume
    25
  • Issue
    3
  • fYear
    2002
  • fDate
    9/1/2002 12:00:00 AM
  • Firstpage
    409
  • Lastpage
    414
  • Abstract
    The behavior of the moving electric arc in low-voltage switching devices is determined by the complex interactions of magnetic forces, current flow, gas flow, heat conduction, and radiation. In this paper three-dimensional simulations of arc motion between parallel arc runners are presented, which consider all these interactions. These simulations are carried out with a computational fluid dynamics (CFD) finite volume code. Based on earlier simulations by Frank Karetta the magnetic field, expressed as vector potential formulation, is now treated by the same type of general transport equations as the other processes, which allows the direct implementation into the CFD package used. This enables one to include the effect of ferromagnetic material in the arc chamber, such as ferromagnetic flux concentrators or steel splitter plates. Typical simulation examples are presented for different design details.
  • Keywords
    circuit breakers; circuit-breaking arcs; computational fluid dynamics; current density; finite volume methods; heat conduction; CFD; arc chamber; arc motion; circuit breakers; computational fluid dynamics; current flow; ferromagnetic material; finite volume code; gas flow; heat conduction; low-voltage switching devices; moving electric arc; parallel arc runners; steel splitter plates; three-dimensional simulations; three-dimensional-simulation; vector potential formulation; Computational fluid dynamics; Computational modeling; Equations; Fluid flow; Magnetic fields; Magnetic forces; Magnetic materials; Magnetic switching; Packaging; Resistance heating;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2002.804604
  • Filename
    1159175