• DocumentCode
    1070243
  • Title

    Arc motion and wave propagation in arc chambers with lateral chinks

  • Author

    Berger, Karl A. ; Gessl, Bernhard ; Schneider, Wilhelm ; Rieder, Werner

  • Author_Institution
    Inst. of Power Syst. & Energy Econ., Univ. of Technol. Vienna, Austria
  • Volume
    25
  • Issue
    3
  • fYear
    2002
  • fDate
    9/1/2002 12:00:00 AM
  • Firstpage
    440
  • Lastpage
    445
  • Abstract
    The effect of lateral chinks on shock wave propagation and arc motion in simplified arc chambers with parallel arc runners were investigated both experimentally and theoretically. Pressure transients were recorded at different positions of the arc chamber. The current supply was symmetric with respect to the arc in order to minimize the effect of the self-blast field on the arc; an external transverse blast field was applied. The arc motion was observed opto-electronically. To describe the arc region, the previously developed slug model was applied. The wave propagation along the arc chamber was treated as spatially one-dimensional. Mass and energy losses due to the chinks were taken into account. Both for shock wave propagation and arc motion good agreement between theoretical predictions and experimental data was obtained with low computational effort. It turned out that narrow chinks favor fast arc motion on parallel arc runners.
  • Keywords
    circuit-breaking arcs; plasma flow; plasma shock waves; transients; arc chambers; arc motion; energy losses; external transverse blast field; gas dynamic model; lateral chinks; magnet blast arc; mass losses; miniature circuit breakers; optoelectronic observation; parallel arc runners; pressure transients; self-blast field; shock wave propagation; slug model; spatially one-dimensional wave propagation; symmetric current supply; Circuit breakers; Contacts; Current supplies; Energy loss; Fluid flow; Geometry; Pistons; Power system dynamics; Power system economics; Shock waves;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2002.804609
  • Filename
    1159180