Development of low loss organic-micromachined interconnects on silicon at microwave frequencies

Author

Newlin, Daniel P. ; Pham, Anh-Vu H. ; Harriss, James E.

Author_Institution

Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA

Volume

25

Issue

3

fYear

2002

fDate

9/1/2002 12:00:00 AM

Firstpage

506

Lastpage

510

Abstract

We present the design and development of an ultra-violet (UV) LIGA (a German acronym for electroplating, lithography and molding) micromachining process on silicon substrates at microwave/millimeter wave frequencies. The process employs an ultra-thick negative photoresist SU-8 that can be spin-coated and processed using conventional lithography techniques. Using this process, we have developed micromachined coplanar waveguide (CPW) interconnects on Si substrates. The conductor-backed micromachined CPW on Si (7.2 Ω-cm) achieves a measured attenuation of 0.18 dB/cm at 20 GHz.

Keywords

LIGA; coplanar waveguides; elemental semiconductors; integrated circuit interconnections; micromachining; radiofrequency integrated circuits; silicon; ultraviolet lithography; 20 GHz; 7.2 ohmcm; RFICs; SU-8; Si; Si substrates; UV LIGA micromachining process; attenuation; conductor-backed micromachined CPW; low loss organic-micromachined interconnects; micromachined coplanar waveguide interconnects; microwave frequencies; spin coating; ultra-thick negative photoresist; Coplanar waveguides; Fabrication; Integrated circuit interconnections; Microwave frequencies; Packaging; Planar transmission lines; Polymers; Propagation losses; Silicon; Substrates;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2002.803654

Filename

1159188