• DocumentCode
    1070348
  • Title

    Magnetostriction in FeTaN thin films

  • Author

    Cates, James C. ; Alexander, Chester, Jr. ; Haftek, Elzbieta ; Barnard, John A.

  • Author_Institution
    Alabama Univ., Tuscaloosa, AL, USA
  • Volume
    29
  • Issue
    6
  • fYear
    1993
  • fDate
    11/1/1993 12:00:00 AM
  • Firstpage
    3105
  • Lastpage
    3107
  • Abstract
    Magnetostriction is studied in FeTaN single layer thin films deposited by high power density, high growth rate, DC magnetron sputtering. Magnetostriction is found to increase linearly with the nitrogen content of the films, passing from negative to positive with increasing nitrogen content. Thinner films exhibit larger positive magnetostriction than thicker films deposited at the same nitrogen flow rate. Film stress is found to be tensile in as-deposited films grown at zero nitrogen pressure. As the nitrogen content in the films increases, the film stress changes from tensile to compressive and increases in magnitude, while annealing at 300°C reduces the magnitude of film stress without affecting magnetostriction. Stress anisotropy is found to reach a minimum at low nitrogen flow rate, and stripe domain formation accompanies large stress anisotropy at high nitrogen flow rates
  • Keywords
    annealing; internal stresses; iron compounds; magnetic thin films; magnetostriction; sputtered coatings; tantalum compounds; FeTaN single layer thin films; N flow rates; annealing; compressive; direct current magnetron sputtering; film stress; positive magnetostriction; stress anisotropy; stripe domain formation; tensile; Anisotropic magnetoresistance; Annealing; Compressive stress; Magnetic anisotropy; Magnetostriction; Nitrogen; Perpendicular magnetic anisotropy; Sputtering; Tensile stress; Transistors;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.280885
  • Filename
    280885