Title :
Metal electromigration induced by solder flux residue in hybrid microcircuits
Author :
Benson, Richard C. ; Romenesko, Bruce M. ; Weiner, Joel A. ; Nall, Berry H. ; Charles, Harry K., Jr.
Author_Institution :
Appl. Phys. Lab., John Hopkins Univ., Laurel, MD, USA
Abstract :
Electrical failure due to excessive current leakage was observed in a hybrid following burn-in. The current leakage was a result of extensive metal electromigration between substrate conductors which had been correlated with flux residue in the device. It has been determined that water and other species are produced by thermal degradation of the flux during burn-in at 125 degrees C. Failure-analysis results along with associated materials and electronic testing are reported.<>
Keywords :
electromigration; failure analysis; hybrid integrated circuits; integrated circuit testing; 125 degC; burn-in; current leakage; electronic testing; failure analysis; hybrid microcircuits; metal electromigration; solder flux residue; substrate conductors; thermal degradation; water; Anodes; Cathodes; Chemicals; Conducting materials; Electromigration; Electronic packaging thermal management; Hybrid integrated circuits; Moisture; Surface contamination; Temperature;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
