DocumentCode
1070466
Title
Metal electromigration induced by solder flux residue in hybrid microcircuits
Author
Benson, Richard C. ; Romenesko, Bruce M. ; Weiner, Joel A. ; Nall, Berry H. ; Charles, Harry K., Jr.
Author_Institution
Appl. Phys. Lab., John Hopkins Univ., Laurel, MD, USA
Volume
11
Issue
4
fYear
1988
Firstpage
363
Lastpage
370
Abstract
Electrical failure due to excessive current leakage was observed in a hybrid following burn-in. The current leakage was a result of extensive metal electromigration between substrate conductors which had been correlated with flux residue in the device. It has been determined that water and other species are produced by thermal degradation of the flux during burn-in at 125 degrees C. Failure-analysis results along with associated materials and electronic testing are reported.<>
Keywords
electromigration; failure analysis; hybrid integrated circuits; integrated circuit testing; 125 degC; burn-in; current leakage; electronic testing; failure analysis; hybrid microcircuits; metal electromigration; solder flux residue; substrate conductors; thermal degradation; water; Anodes; Cathodes; Chemicals; Conducting materials; Electromigration; Electronic packaging thermal management; Hybrid integrated circuits; Moisture; Surface contamination; Temperature;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.16669
Filename
16669
Link To Document