• DocumentCode
    1070611
  • Title

    Failure analysis requirements for nanoelectronics

  • Author

    Vallett, David P.

  • Author_Institution
    IBM Microelectron. Div., Essex Junction, VT, USA
  • Volume
    1
  • Issue
    3
  • fYear
    2002
  • fDate
    9/1/2002 12:00:00 AM
  • Firstpage
    117
  • Lastpage
    121
  • Abstract
    Failure analysis (FA) plays a vital role in the development and manufacture of integrated circuits. However, instrumental limits are already threatening FA in the tenth-micron CMOS realm, and nanoelectronic devices will find key analytical tools two orders of magnitude removed in capability. This paper will introduce state-of-the-art microelectronic failure analysis processes, instrumentation, and principles. It will discuss the major limitations and future prospects determined from industry roadmaps. Specifically highlighted is the need for a fault isolation methodology for failure analysis of fully integrated nanoelectronics devices.
  • Keywords
    CMOS integrated circuits; failure analysis; inspection; integrated circuit testing; nanoelectronics; CMOS; failure analysis requirements; fault isolation methodology; industry roadmaps; inspection; instrumentation; microelectronic failure; nanoelectronics; Atomic force microscopy; Circuit faults; Failure analysis; Inspection; Instruments; Magnetic force microscopy; Microelectronics; Nanoelectronics; Scanning electron microscopy; Transmission electron microscopy;
  • fLanguage
    English
  • Journal_Title
    Nanotechnology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1536-125X
  • Type

    jour

  • DOI
    10.1109/TNANO.2002.806826
  • Filename
    1159212