• DocumentCode
    1070641
  • Title

    Void ratios and mechanical losses in simulated CIC conductors with non-metallic conduit materials

  • Author

    Takao, Tomoaki ; Yamaguchi, Yoshio ; Obama, Junichi ; Seki, Yoshitaka ; Miyagi, Daisuke ; Yamanaka, Atsuhiko

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Sophia Univ., Tokyo, Japan
  • Volume
    14
  • Issue
    2
  • fYear
    2004
  • fDate
    6/1/2004 12:00:00 AM
  • Firstpage
    1310
  • Lastpage
    1312
  • Abstract
    We have fabricated cable-in-conduit conductors (CICCs) with two kinds of nonmetallic conduit materials. Differences of frictional coefficients on surfaces of the materials vary by factors of two or three, and void ratios of the conductors are from 14% to 42%. We wound these CICCs on same-shaped bobbins, and measured the AC losses of the CICC coils. In spite of the fact that the coil shape, the superconducting wire, and background magnetic fields were the same, the measured losses were not, and depended on conduit materials and void ratios. According to the experimental results, in order to decrease the losses, a conduit material with high frictional coefficient is desirable. It is also shown that the losses decrease with the decrease of the void ratios in the CICCs.
  • Keywords
    conductors (electric); eddy current losses; friction; loss measurement; magnetic fields; superconducting coils; superconducting tapes; AC losses; CICC coils; background magnetic fields; cable-in-conduit conductors; coil shape; friction; frictional coefficients; mechanical losses; nonmetallic conduit materials; same-shaped bobbins; superconducting wire; void ratios; Conducting materials; Loss measurement; Magnetic field measurement; Magnetic materials; Superconducting cables; Superconducting coils; Superconducting filaments and wires; Superconducting magnets; Superconducting materials; Wounds; AC loss; cable-in-conduit-cable; friction; mechanical loss; void ratio;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2004.830563
  • Filename
    1325040