Title :
Low-temperature, low-dielectric, crystallizable glass composite
Author :
Jean, Jau-Ho ; Lin, Shih-Chang ; Chang, Chia-Ruey
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fDate :
11/1/1995 12:00:00 AM
Abstract :
A low k crystallizable glass composite containing borosilicate glass and cordierite glass has been developed. Crystallization and densification of cordierite glass is enhanced with borosilicate glass present. For the compositions identified, a high sintered density greater than 95% can be obtained at 825-900°C. The crystallizable glass composite has a dielectric constant of 5.3 and a dielectric loss less than 0.3% at 1 MHz, and a tunable thermal expansion coefficient of 3.9-4.5×10-6 K-1 in the temperature range of 20-200°C by controlling heat treatment
Keywords :
aluminosilicate glasses; borosilicate glasses; ceramics; densification; dielectric losses; heat treatment; integrated circuit packaging; permittivity; sintering; substrates; thermal expansion; 1 MHz; 20 to 200 degC; 825 to 900 degC; IC packaging substrates; SiO2-Al2O3-MgO; SiO2-B2O3; borosilicate glass; cordierite glass; crystallizable glass composite; densification; dielectric constant; dielectric loss; glass-ceramics; heat treatment; sintered density; tunable thermal expansion coefficient; Ceramics; Character generation; Crystallization; Dielectric constant; Dielectric losses; Dielectric substrates; Glass; Powders; Temperature; Thermal expansion;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
