DocumentCode
107148
Title
Design Metrics Improvement for SRAMs Using Symmetric Dual-
Spacer (SymD-
) FinFETs
Author
Pal, Pankaj Kumar ; Kaushik, B.K. ; Dasgupta, S.
Author_Institution
Dept. of Electron. & Commun. Eng., Indian Inst. of Technol.-Roorkee, Roorkee, India
Volume
61
Issue
4
fYear
2014
fDate
Apr-14
Firstpage
1123
Lastpage
1130
Abstract
Underlap FinFET devices, or trigate transistors, are considered to be the most favorable substitute to the conventional bulk device below 22-nm technology node. However, their application in circuit design requires specific attention because of the fin width quantization and increased parasitic. This paper proposes a double dielectric or dual- k spacers technology to enhance the electrostatic integrity of underlap FinFETs. For the first time, we investigate the circuit performance such as that of static RAMs (SRAMs), based on the proposed dual- k spacer FinFETs. The proposed structure enhances SRAMs performance in terms of robustness, access times, and the leakage power during all possible modes of operation. The hold, read, and write-margin increases by 8.7%, 9.4%, and 10.4%, respectively, as compared with conventional FinFET SRAM. Furthermore, the read and write access times reduces by 56% and 17.1%, respectively. Moreover, the standby leakage power is also reduced by ~ 73% compared with the conventional FinFET-based SRAM while occupying same bit-cell area.
Keywords
MOSFET; SRAM chips; electrostatics; SRAM; SymD-k; bulk device; circuit design; circuit performance; design metrics improvement; double dielectric spacers; electrostatic integrity; fin width quantization; read access time; standby leakage power; static RAM; symmetric dual-k spacer FinFET; trigate transistors; underlap FinFET; write access time; Capacitance; FinFETs; High K dielectric materials; Logic gates; Performance evaluation; Random access memory; Access time; dual-$k$ spacer; low-power; read/write conflict; robustness; static RAM (SRAM) cell; underlap FinFET;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2014.2304711
Filename
6744633
Link To Document