Monolithic integration of RF MEMS switches with a diversity antenna on PCB substrate

Author

Cetiner, B.A. ; Qian, J.Y. ; Chang, H.P. ; Bachman, M. ; Li, G.P. ; De Flaviis, F.

Author_Institution

Electr. Eng. & Comput. Sci. Dept., Univ. of California, Irvine, CA, USA

Volume

51

Issue

1

fYear

2003

fDate

1/1/2003 12:00:00 AM

Firstpage

332

Lastpage

335

Abstract

A novel process for monolithic integration of RF microelectromechanical system (MEMS) switches with three-dimensional antenna elements on a microwave laminate printed circuit board (PCB) is presented. This process calls for a low-temperature (90°C-170°C) high-density inductively coupled plasma chemical vapor deposition technique that allows the choice of any PCB substrate, such as RO4003-FR4 (ε_r=3.38, tanδ=0.002), with the desired electrical properties for antenna applications. A two-element diversity antenna system monolithically integrated with RF MEMS switches is designed and demonstrated.

Keywords

microswitches; microwave antennas; plasma CVD; printed circuits; 90 to 170 degC; PCB substrate; RF MEMS switch; RO4003-FR4; diversity antenna; electrical properties; high-density inductively coupled plasma chemical vapor deposition; low-temperature process; microwave laminate printed circuit board; monolithic integration; three-dimensional antenna; Chemical elements; Laminates; Micromechanical devices; Microwave antennas; Monolithic integrated circuits; Plasma properties; Printed circuits; Radiofrequency microelectromechanical systems; Switches; Switching circuits;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2002.806521

Filename

1159649