Title :
Effect of orifice location on heat transfer in a duct filled with pressurized He II
Author :
Konishi, Soujirou ; Fujita, Kenji ; Okamura, Takahiro ; Shirai, Yasuyuki ; Shiotsu, Masahiro
Author_Institution :
Dept. of Energy Sci. & Technol., Kyoto Univ., Japan
fDate :
6/1/2004 12:00:00 AM
Abstract :
Steady-state and transient heat transfer on a flat plate at one end of a rectangular duct with an orifice were measured in He II for bath temperatures of 1.8 K to 2.14 K at atmospheric pressure. The steady-state critical heat flux (CHF) was slightly affected by the orifice location. The transient heat transfer for a stepwise heat input with a magnitude larger than the CHF showed a quasi steady-state with a certain lifetime on the extrapolation of steady-state Kapitza conductance curve. The relation between the lifetime and step heat flux was significantly affected by the orifice location. Numerical analysis was performed for the steady-state and the transient heat transfer in the duct with the orifice by using the two-dimensional computer code named SUPER-2D based on the two-fluid model and the theory of mutual friction. The solutions of CHF and lifetime agreed well with the experimental data. The heat transport mechanism was clarified by the analysis.
Keywords :
computational fluid dynamics; cryogenics; heat transfer; pipe flow; superconducting magnets; superfluid helium-4; two-phase flow; 1.8 to 2.14 K; 2D computer code; He; SUPER-2D; atmospheric pressure; bath temperatures; flat plate; heat transport mechanism; mutual friction; numerical analysis; orifice location effect; pressurized He II; rectangular duct; steady-state Kapitza conductance curve extrapolation; steady-state critical heat flux; steady-state heat transfer; transient heat transfer; two-fluid model; Atmospheric measurements; Ducts; Extrapolation; Heat transfer; Helium; Numerical analysis; Orifices; Pressure measurement; Steady-state; Temperature; He II; heat transfer; two-dimensional; two-fluid model;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2004.831071