DocumentCode :
1072753
Title :
Low-Impedance VHF and UHF Capacitive Silicon Bulk Acoustic Wave Resonators—Part I: Concept and Fabrication
Author :
Pourkamali, Siavash ; Ho, Gavin K. ; Ayazi, Farrokh
Author_Institution :
Denver Univ., Denver
Volume :
54
Issue :
8
fYear :
2007
Firstpage :
2017
Lastpage :
2023
Abstract :
This paper presents high-performance high-frequency single-crystal silicon (SCS) capacitive resonators. Long and thick bulk-micromachined resonating block structures, which are referred to as ldquosilicon bulk acoustic wave resonatorrdquo (SiBAR), are fabricated using the high-aspect-ratio poly and single crystalline siliconrdquo (HARPSS) fabrication process on silicon-on-insulator (SOI) substrates. Such resonators operate in their horizontal width extensional modes with quality factors in the range of 10000-100000. With their comparatively large electrode area and deep-submicrometer capacitive transduction gaps, such resonators have demonstrated comparatively low impedances for capacitive resonators that are well within the desired range for high-frequency electronic applications. Sub-kilo-Ohm total electrical resistances and extracted motional resistance as low as 200 are demonstrated for the fundamental width extensional modes of SiBARs in the very-high-frequency range. Resonant frequencies up to 1.55 GHz are demonstrated for the higher resonance modes of the capacitive SiBARs with comparatively low impedances. Part I of this paper presents the basic operation concepts and fabrication methodology for the HARPSS-on-SOI SiBARs. Extensive resonator measurement data, including temperature characteristics, are presented in Part II of this paper, and different frequency tuning approaches for temperature compensation of such resonators are discussed and investigated.
Keywords :
UHF devices; VHF devices; acoustic resonators; bulk acoustic wave devices; micromachining; micromechanical resonators; silicon; silicon-on-insulator; HARPSS-on-SOI SiBAR; MEMS; UHF; VHF; bulk-micromachined resonating block structures; capacitive resonators; capacitive silicon bulk acoustic wave resonator; deep-submicrometer capacitive transduction gaps; extracted motional resistance; frequency tuning; high-aspect-ratio poly and single crystalline silicon; micromachining; micromechanical resonators; resonant frequencies; silicon-on-insulator substrates; single-crystal silicon; sub-kilo-ohm total electrical resistances; temperature compensation; Acoustic waves; Crystallization; Electric resistance; Electrodes; Fabrication; Impedance; Q factor; Resonant frequency; Silicon on insulator technology; Temperature measurement; Bulk acoustic wave resonators; MEMS; high-aspect-ratio poly and single crystalline silicon (HARPSS); micromachining; micromechanical resonators; silicon resonators;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2007.901403
Filename :
4277975
Link To Document :
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