A high-speed low-voltage double-switch optical crossconnect using stress-induced bending micromirrors

A high-speed low-voltage double-switch electrostatically actuated optical crossconnect (OXC) is demonstrated using stress-induced bending micromirrors. A curved polysilicon seesaw structure substantially lowers the electrostatic operating voltage of the OXC and provides a double-switch option. Large mirror deflection angles of 13/spl deg/ (mirror elevation of 290 μm high) and 5/spl deg/ (cantilever deflection of 90 μm high), corresponding to low operating voltages of 25 and 18 V, could be obtained. A submillisecond switching time (<850 μs), a low optical insertion loss (0.65 dB), and a small polarization-dependent loss (<0.08 dB) are achieved.