DocumentCode :
1072960
Title :
Effect of Insulative Debris on the Contact Resistance of Anisotropic Conductive Film (ACF) Adhesives: A Comparison Between a Solid Conducting Particle and a Coated Insulative Particle
Author :
Divigalpitiya, Ranjith
Author_Institution :
3M Canada Co., London
Volume :
31
Issue :
1
fYear :
2008
fDate :
3/1/2008 12:00:00 AM
Firstpage :
222
Lastpage :
228
Abstract :
The electrical contact resistance of two types of particles, solid conductive particles and insulating particles coated with a conductive coating, used in anisotropic conductive film (ACF) adhesive as current carrying components are investigated. The effect of insulative debris on both types of particles is explored using finite element analysis. Analysis shows that the contact resistance of coated particles is more immune to contaminants than solid particles. Thus, ACFs made with coated particles have a double advantage over solid conducting particles: one of economy, and the other, on robust electrical performance of a forgiving nature in applications.
Keywords :
adhesive bonding; anisotropic media; conductive adhesives; contact resistance; finite element analysis; insulating materials; anisotropic conductive film adhesives; coated insulative particle; current carrying components; electrical contact resistance; finite element analysis; insulative debris effect; solid conducting particle; Adhesive; aniostropic conductive film (ACF); bonding; contact resistance;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2008.916789
Filename :
4454211
Link To Document :
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