• DocumentCode
    1072960
  • Title

    Effect of Insulative Debris on the Contact Resistance of Anisotropic Conductive Film (ACF) Adhesives: A Comparison Between a Solid Conducting Particle and a Coated Insulative Particle

  • Author

    Divigalpitiya, Ranjith

  • Author_Institution
    3M Canada Co., London
  • Volume
    31
  • Issue
    1
  • fYear
    2008
  • fDate
    3/1/2008 12:00:00 AM
  • Firstpage
    222
  • Lastpage
    228
  • Abstract
    The electrical contact resistance of two types of particles, solid conductive particles and insulating particles coated with a conductive coating, used in anisotropic conductive film (ACF) adhesive as current carrying components are investigated. The effect of insulative debris on both types of particles is explored using finite element analysis. Analysis shows that the contact resistance of coated particles is more immune to contaminants than solid particles. Thus, ACFs made with coated particles have a double advantage over solid conducting particles: one of economy, and the other, on robust electrical performance of a forgiving nature in applications.
  • Keywords
    adhesive bonding; anisotropic media; conductive adhesives; contact resistance; finite element analysis; insulating materials; anisotropic conductive film adhesives; coated insulative particle; current carrying components; electrical contact resistance; finite element analysis; insulative debris effect; solid conducting particle; Adhesive; aniostropic conductive film (ACF); bonding; contact resistance;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2008.916789
  • Filename
    4454211