Title :
Interconnection reliability
Author :
Reagor, Barbara T.
Author_Institution :
Bellcore, Red Bank, NJ, USA
fDate :
12/1/1988 12:00:00 AM
Abstract :
Presents a summary of some of the key features that can affect interconnection reliability. In particular, addresses how manufacturing contamination, materials selection, lubrication, and environmental protection affect all levels of interconnection. The information is documented through discussion of actual field failures
Keywords :
environmental testing; failure analysis; lubrication; reliability; environmental protection; field failures; interconnection reliability; lubrication; manufacturing contamination; materials selection; Communication industry; Contamination; Digital systems; Manufacturing; Packaging; Protection; Semiconductor device manufacture; Stability; Switches; Wire;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
