DocumentCode :
1073446
Title :
Packaged X-band filter with optimized interconnects [Technical Committee]
Author :
Baras, Torben
Author_Institution :
Tech. Univ. Hamburg-Harburg, Hamburg
Volume :
10
Issue :
1
fYear :
2009
fDate :
2/1/2009 12:00:00 AM
Firstpage :
146
Lastpage :
150
Abstract :
As part of a student contest at the International Microwave Symposium 2008 in Atlanta, a packaged X-band filter was designed and fabricated. The passive component had to be realized in a planar technology and integrated into a provided metal package, the passband being defined from 7,145-7,235 MHz with an insertion loss less than 5 dB and a return loss better than 15 dB. The filter should exhibit a stopband in the range from 8,400-8,500 MHz with an attenuation of more than 45 dB. In the following, the individual challenges during the design and fabrication as well as their solutions are described.
Keywords :
band-pass filters; band-stop filters; interconnections; microwave filters; passive filters; attenuation; frequency 7145 MHz to 7235 MHz; frequency 8400 MHz to 8500 MHz; insertion loss; metal package; optimized interconnects; packaged X-band filter; passband; passive component; planar technology; return loss; stopband; Attenuation; Band pass filters; Cutoff frequency; Glass; Insertion loss; Packaging; Rough surfaces; Surface roughness; Topology; Transmission line theory;
fLanguage :
English
Journal_Title :
Microwave Magazine, IEEE
Publisher :
ieee
ISSN :
1527-3342
Type :
jour
DOI :
10.1109/MMM.2008.930752
Filename :
4754021
Link To Document :
بازگشت