• DocumentCode
    1073537
  • Title

    Prediction of surface temperature rise of ultrasonic diagnostic array transducers

  • Author

    Won-Suk Ohm ; Jeong Hwan Kim ; Eim Chul Kim

  • Author_Institution
    Medison Co. Ltd., Seoul
  • Volume
    55
  • Issue
    1
  • fYear
    2008
  • fDate
    1/1/2008 12:00:00 AM
  • Firstpage
    125
  • Lastpage
    138
  • Abstract
    Temperature rise at the surface of an ultrasound transducer used for diagnostic imaging is an important factor in patient safety and regulatory compliance. This paper presents a semianalytical model that is derived from first principles of heat transfer and is simple enough to be implemented in a commercial ultrasound scanner for real-time forecasting of transducer surface temperature. For modeling purposes, one-dimensional array transducers radiating into still air are considered. Promising experimental verification data are shown and practical implementation benefits of the model for thermal design and management of ultrasonic array transducers are discussed. In particular, the reduction in the amount of thermal characterization data required, compared to empirical models, shows promise.
  • Keywords
    biomedical ultrasonics; heat transfer; ultrasonic imaging; ultrasonic transducer arrays; diagnostic imaging; heat transfer; one-dimensional array transducers; patient safety; real-time forecasting; regulatory compliance; surface temperature rise; ultrasonic array transducers; ultrasound scanner; Biomedical imaging; Biomedical transducers; Finite element methods; Heat transfer; Medical diagnostic imaging; Probes; Temperature sensors; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers; Computer Simulation; Computer-Aided Design; Energy Transfer; Equipment Safety; Models, Theoretical; Radiometry; Scattering, Radiation; Temperature; Transducers; Ultrasonography;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/TUFFC.2008.622
  • Filename
    4454308