Title :
Enhanced Flux-Pinning in Dy-Doped, MOD YBCO Films on RABiTS
Author :
Goyal, A. ; Li, J. ; Martin, P.M. ; Gapud, A. ; Specht, E.D. ; Paranthaman, M. ; Li, X. ; Zhang, W. ; Kodenkandath, T. ; Rupich, M.W.
Author_Institution :
Oak Ridge Nat. Lab., Oak Ridge
fDate :
6/1/2007 12:00:00 AM
Abstract :
Significant enhancements in flux-pinning were obtained for Dy-doped, YBCO films via a metalorganic deposition (MOD) process on rolling-assisted biaxially textured substrates (RABiTS). It has been reported previously that incorporation of excess rare-earth ions during the MOD process, results in improvement of Jc for H//c, however, a decrease in Jc for H//ab is observed. We report here that by altering the processing conditions the reduction in the magnitude of the current peak for H//ab can be minimized while significantly enhancing the random pinning at all field orientations. The result is a YBCO film with significantly reduced anisotropy compared to the typical YBCO films prepared by the MOD process. This is accomplished by incorporating both a high density of stacking faults and (Dy, Y)2O3 nanoparticles which result in the strong pinning for H//ab and a broad pinning peak for H//c respectively.
Keywords :
MOCVD; barium compounds; critical current density (superconductivity); dysprosium; flux pinning; high-temperature superconductors; nanoparticles; stacking faults; superconducting thin films; yttrium compounds; YBa2Cu3O7:Dy; critical current density; films; flux pinning; metalorganic deposition; nanoparticles; rolling-assisted biaxially textured substrates; stacking faults; Anisotropic magnetoresistance; Conductive films; Critical current density; High temperature superconductors; Nanoparticles; Stacking; Substrates; Superconducting epitaxial layers; Superconducting films; Yttrium barium copper oxide; Angular dependence; MOD films; RABiTS; coated conductor; critical current density; flux-pinning; intergrowths; nanodots; stacking faults; wires;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2007.898957