DocumentCode
1074251
Title
The effect of magnetic package leads on the measurement of thermal resistance of semiconductor devices
Author
Berning, D.W. ; Blackburn, D.L.
Author_Institution
National Bureau of Standards, Washington, DC
Volume
28
Issue
5
fYear
1981
fDate
5/1/1981 12:00:00 AM
Firstpage
609
Lastpage
611
Abstract
Magnetic package leads can cause errors in the measurement of the thermal resistance of semiconductor devices. The errors are the result of distortions of the voltage waveforms apparently caused by an increase in the impedance of the leads at short times after switching. This is related to the skin effect, which is the tendency of currents to concentrate on the surface of and decay exponentially into the leads. The concentration increases as the magnetic permeability increases. The influence of the skin effect in the magnetic leads on the measured waveforms and on the measured thermal resistance is shown. A technique for correcting the measured thermal resistance is demonstrated.
Keywords
Distortion measurement; Electrical resistance measurement; Lead compounds; Magnetic devices; Magnetic semiconductors; Semiconductor device measurement; Semiconductor device packaging; Semiconductor devices; Skin effect; Thermal resistance;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1981.20397
Filename
1481549
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