• DocumentCode
    1074251
  • Title

    The effect of magnetic package leads on the measurement of thermal resistance of semiconductor devices

  • Author

    Berning, D.W. ; Blackburn, D.L.

  • Author_Institution
    National Bureau of Standards, Washington, DC
  • Volume
    28
  • Issue
    5
  • fYear
    1981
  • fDate
    5/1/1981 12:00:00 AM
  • Firstpage
    609
  • Lastpage
    611
  • Abstract
    Magnetic package leads can cause errors in the measurement of the thermal resistance of semiconductor devices. The errors are the result of distortions of the voltage waveforms apparently caused by an increase in the impedance of the leads at short times after switching. This is related to the skin effect, which is the tendency of currents to concentrate on the surface of and decay exponentially into the leads. The concentration increases as the magnetic permeability increases. The influence of the skin effect in the magnetic leads on the measured waveforms and on the measured thermal resistance is shown. A technique for correcting the measured thermal resistance is demonstrated.
  • Keywords
    Distortion measurement; Electrical resistance measurement; Lead compounds; Magnetic devices; Magnetic semiconductors; Semiconductor device measurement; Semiconductor device packaging; Semiconductor devices; Skin effect; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1981.20397
  • Filename
    1481549