Demonstration of three-dimensional microstructure self-assembly

Author

Green, P.W. ; Syms, R.R.A. ; Yeatman, E.M.

Author_Institution

Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK

Volume

4

Issue

4

fYear

1995

fDate

12/1/1995 12:00:00 AM

Firstpage

170

Lastpage

176

Abstract

Self-assembly of three-dimensional microstructures using the surface tension force of molten solder to produce out-of-plane rotation is demonstrated. The generic nature of the technique is illustrated by reconfiguring structures formed in both Ni metal and single crystal Si. The structures do not have a hinge to constrain the rotation. This considerably simplifies fabrication and eliminates problems associated with the compatibility of a suitable hinge material. Details of the fabrication processes are given and results are presented for rotated structures

Keywords

elemental semiconductors; micromechanical devices; nickel; semiconductor technology; silicon; soldering; surface tension; Ni; Si; compatibility; fabrication processes; hinge material; molten solder; out-of-plane rotation; rotated structures; self-assembly; surface tension force; three-dimensional microstructure; Anisotropic magnetoresistance; Assembly; Fabrication; Fasteners; Micromachining; Microstructure; Resists; Self-assembly; Sensor arrays; Silicon;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/84.475543

Filename

475543